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2-641605-2
TE Connectivity AMP Connectors
2-641605-2
CONN IC DIP SOCKET 28POS GOLD
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2-641605-2 Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Series | Diplomate DL | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Number of Positions or Pins (Grid) | 28 (2 x 14) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Open Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Thermoplastic, Glass Filled | |
Operating Temperature | -55°C ~ 125°C |
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