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HMP112P7EFR4C-C4
SK Hynix Inc
HMP112P7EFR4C-C4
HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
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HMP112P7EFR4C-C4 Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | ||
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 1.0737 Gbit | |
| Memory Width | 8 | |
| Organization | 128MX8 | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Access Time-Max | ||
| Clock Frequency-Max (fCLK) | ||
| Refresh Cycles | ||
| Access Mode | SINGLE BANK PAGE BURST | |
| Memory IC Type | DDR DRAM MODULE | |
| Additional Feature | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX | |
| I/O Type | ||
| Interleaved Burst Length | ||
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Words Code | 128000000 | |
| Number of Words | 134.2177 M | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | ||
| Self Refresh | YES | |
| Sequential Burst Length | ||
| Supply Current-Max | ||
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-XZMA-N200 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | ||
| Operating Temperature-Max | 55 °C | |
| Operating Temperature-Min | ||
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 240 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIMM | |
| Package Equivalence Code | ||
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Surface Mount | NO | |
| Terminal Finish | ||
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1 mm | |
| Terminal Position | ZIG-ZAG | |
| Seated Height-Max | 30 mm | |
| Length | 133.35 mm | |
| Width | 2.7 mm | |
| Ihs Manufacturer | SK HYNIX INC | |
| Part Package Code | DIMM | |
| Package Description | HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 |
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