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ED32DT

On Shore Technology Inc.
ED32DT
CONN IC DIP SOCKET 32POS TIN
Active
ED32DT
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ED32DT Attributes
TYPE DESCRIPTION SELECT
Series ED
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 32 (2 x 16)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 60.0µin (1.52µm)
Contact Material - Mating Phosphor Bronze
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 60.0µin (1.52µm)
Contact Material - Post Phosphor Bronze
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C ~ 110°C
1,437 In Stock
rhos iso9001 iso13485 iso14001 iso45001
Minimum: 1
Unit Price: $0.47
Total Price: $0.47
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