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XR2D-2401-N
Omron Electronics Inc-EMC Div
XR2D-2401-N
CONN IC DIP SOCKET 24POS GOLD
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XR2D-2401-N Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Series | XR2 | |
| Type | DIP, 0.6" (15.24mm) Row Spacing | |
| Number of Positions or Pins (Grid) | 24 (2 x 12) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 29.5µin (0.75µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Carrier | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Gold | |
| Contact Finish Thickness - Post | 29.5µin (0.75µm) | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | |
| Operating Temperature | -55°C ~ 125°C |
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