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MT9LSDT872Y-10EXX
Micron Technology Inc
MT9LSDT872Y-10EXX
DIMM,
Active
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MT9LSDT872Y-10EXX Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Memory Density | 603.9798 Mbit | |
Memory Width | 72 | |
Organization | 8MX72 | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Access Time-Max | 6 ns | |
Refresh Cycles | ||
Access Mode | SINGLE BANK PAGE BURST | |
Memory IC Type | SYNCHRONOUS DRAM MODULE | |
Additional Feature | AUTO/SELF REFRESH | |
Alternate Memory Width | ||
I/O Type | ||
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words Code | 8000000 | |
Number of Words | 8.3886 M | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | ||
Self Refresh | YES | |
Standby Current-Max | ||
Supply Current-Max | ||
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-XDMA-N168 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e4 | |
Moisture Sensitivity Level | ||
Operating Temperature-Max | 55 °C | |
Number of Terminals | 168 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | ||
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Surface Mount | NO | |
Terminal Finish | GOLD | |
Terminal Form | NO LEAD | |
Terminal Pitch | ||
Terminal Position | DUAL | |
Seated Height-Max | ||
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | DIMM | |
Package Description | DIMM, | |
Pin Count | 168 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 |
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