Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
MT8LSDT864LHG-662B3
Micron Technology Inc
MT8LSDT864LHG-662B3
Active
Payment Methods:
Shipping Methods:
MT8LSDT864LHG-662B3 Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | ||
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 536.8709 Mbit | |
| Memory Width | 64 | |
| Organization | 8MX64 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Access Time-Max | 7 ns | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| Refresh Cycles | 4096 | |
| Access Mode | ||
| Memory IC Type | SYNCHRONOUS DRAM MODULE | |
| Additional Feature | ||
| I/O Type | COMMON | |
| Number of Functions | ||
| Number of Ports | ||
| Number of Words Code | 8000000 | |
| Number of Words | 8.3886 M | |
| Operating Mode | ||
| Output Characteristics | 3-STATE | |
| Self Refresh | ||
| Standby Current-Max | 24 mA | |
| Supply Current-Max | 1.36 mA | |
| Supply Voltage-Max (Vsup) | ||
| Supply Voltage-Min (Vsup) | ||
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDMA-N144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | ||
| Moisture Sensitivity Level | ||
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIMM | |
| Package Equivalence Code | DIMM144,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Surface Mount | NO | |
| Terminal Finish | ||
| Terminal Form | NO LEAD | |
| Terminal Pitch | 800 µm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 26.67 mm | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | ||
| Package Description | ||
| Pin Count | ||
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Date Of Intro |
3,137
In Stock
Minimum: 1
Unit Price:
N/A
Total Price:
N/A
This price is for reference only, please contact us for now price support@easev.net.
