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MT8LSDF3264LWG-10E
Micron Technology Inc
MT8LSDF3264LWG-10E
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MT8LSDF3264LWG-10E Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | ||
| Rohs Code | ||
| Part Life Cycle Code | Obsolete | |
| Memory Density | 2.1475 Gbit | |
| Memory Width | 64 | |
| Organization | 32MX64 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Access Time-Max | 6 ns | |
| Clock Frequency-Max (fCLK) | 125 MHz | |
| Refresh Cycles | 8192 | |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | |
| I/O Type | COMMON | |
| Number of Words Code | 32000000 | |
| Number of Words | 33.5544 M | |
| Output Characteristics | 3-STATE | |
| Standby Current-Max | 16 mA | |
| Supply Current-Max | 2.16 mA | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDMA-N144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | ||
| Moisture Sensitivity Level | ||
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIMM | |
| Package Equivalence Code | DIMM144(UNSPEC) | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Surface Mount | NO | |
| Terminal Finish | ||
| Terminal Form | NO LEAD | |
| Terminal Pitch | ||
| Terminal Position | DUAL | |
| Seated Height-Max | ||
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | ||
| Package Description |
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