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MT8HTF6464HG-40EC2
Micron Technology Inc
MT8HTF6464HG-40EC2
SODIMM-200
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MT8HTF6464HG-40EC2 Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 4.295 Gbit | |
| Memory Width | 64 | |
| Organization | 64MX64 | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Access Time-Max | 600 ps | |
| Access Mode | SINGLE BANK PAGE BURST | |
| Memory IC Type | DDR DRAM MODULE | |
| Additional Feature | AUTO/SELF REFRESH | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Words Code | 64000000 | |
| Number of Words | 67.1089 M | |
| Operating Mode | SYNCHRONOUS | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-XDMA-N200 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | ||
| Operating Temperature-Max | 65 °C | |
| Operating Temperature-Min | ||
| Peak Reflow Temperature (Cel) | 235 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 200 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIMM | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Surface Mount | NO | |
| Terminal Finish | ||
| Terminal Form | NO LEAD | |
| Terminal Position | DUAL | |
| Seated Height-Max | ||
| Length | ||
| Width | ||
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | MODULE | |
| Package Description | SODIMM-200 | |
| Pin Count | 200 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 |
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