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MT4LSDT464HG-662B2
Micron Technology Inc
MT4LSDT464HG-662B2
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MT4LSDT464HG-662B2 Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | ||
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 268.4355 Mbit | |
Memory Width | 64 | |
Organization | 4MX64 | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Access Time-Max | 7 ns | |
Clock Frequency-Max (fCLK) | 100 MHz | |
Refresh Cycles | 4096 | |
Access Mode | ||
Memory IC Type | SYNCHRONOUS DRAM MODULE | |
Additional Feature | ||
I/O Type | COMMON | |
Number of Functions | ||
Number of Ports | ||
Number of Words Code | 4000000 | |
Number of Words | 4.1943 M | |
Operating Mode | ||
Output Characteristics | 3-STATE | |
Self Refresh | ||
Standby Current-Max | 12 mA | |
Supply Current-Max | 680 µA | |
Supply Voltage-Max (Vsup) | ||
Supply Voltage-Min (Vsup) | ||
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-PDMA-N144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | ||
Moisture Sensitivity Level | ||
Operating Temperature-Max | 70 °C | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIMM | |
Package Equivalence Code | DIMM144,32 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Surface Mount | NO | |
Terminal Finish | ||
Terminal Form | NO LEAD | |
Terminal Pitch | 800 µm | |
Terminal Position | DUAL | |
Seated Height-Max | 25.4 mm | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | ||
Package Description | ||
Pin Count | ||
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Date Of Intro |
8,690
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