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MT4LSDT464AG-10C
Micron Technology Inc
MT4LSDT464AG-10C
DIMM, DIMM168
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MT4LSDT464AG-10C Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 268.4355 Mbit | |
| Memory Width | 64 | |
| Organization | 4MX64 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Access Time-Max | 6 ns | |
| Clock Frequency-Max (fCLK) | 125 MHz | |
| Refresh Cycles | 4096 | |
| Access Mode | ||
| Memory IC Type | SYNCHRONOUS DRAM MODULE | |
| Additional Feature | ||
| Alternate Memory Width | ||
| I/O Type | COMMON | |
| Number of Functions | ||
| Number of Ports | ||
| Number of Words Code | 4000000 | |
| Number of Words | 4.1943 M | |
| Operating Mode | ||
| Output Characteristics | 3-STATE | |
| Self Refresh | ||
| Standby Current-Max | 8 mA | |
| Standby Voltage-Min | ||
| Supply Current-Max | 840 µA | |
| Supply Voltage-Max (Vsup) | ||
| Supply Voltage-Min (Vsup) | ||
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDMA-N168 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | ||
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 168 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIMM | |
| Package Equivalence Code | DIMM168 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Surface Mount | NO | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | ||
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | DIMM, DIMM168 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Part Package Code | ||
| Pin Count | ||
| Date Of Intro | 1998-07-01 |
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