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MT4LC1M16C3D24ADC2-7
Micron Technology Inc
MT4LC1M16C3D24ADC2-7
DIE,
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MT4LC1M16C3D24ADC2-7 Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | ||
| Rohs Code | ||
| Part Life Cycle Code | Obsolete | |
| Memory Density | 16.7772 Mbit | |
| Memory Width | 16 | |
| Organization | 1MX16 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Access Time-Max | 70 ns | |
| Clock Frequency-Max (fCLK) | ||
| Refresh Cycles | 1024 | |
| Access Mode | FAST PAGE | |
| Memory IC Type | EDO DRAM | |
| Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
| Alternate Memory Width | ||
| I/O Type | ||
| Interleaved Burst Length | ||
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Words Code | 1000000 | |
| Number of Words | 1.0486 M | |
| Operating Mode | ASYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Self Refresh | ||
| Sequential Burst Length | ||
| Standby Current-Max | ||
| Supply Current-Max | ||
| Supply Voltage-Max (Vsup) | ||
| Supply Voltage-Min (Vsup) | ||
| Technology | CMOS | |
| Temperature Grade | ||
| JESD-30 Code | R-XUUC-N57 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | ||
| Moisture Sensitivity Level | ||
| Operating Temperature-Max | ||
| Operating Temperature-Min | ||
| Peak Reflow Temperature (Cel) | ||
| Time@Peak Reflow Temperature-Max (s) | ||
| Number of Terminals | 57 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | ||
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Surface Mount | YES | |
| Terminal Finish | ||
| Terminal Form | NO LEAD | |
| Terminal Pitch | ||
| Terminal Position | UPPER | |
| Seated Height-Max | ||
| Length | ||
| Width | ||
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | DIE | |
| Package Description | DIE, | |
| Pin Count | 57 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 |
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