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MT4C1004JD30AWC2
Micron Technology Inc
MT4C1004JD30AWC2
DIE,
Active
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MT4C1004JD30AWC2 Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | ||
Rohs Code | ||
Part Life Cycle Code | Obsolete | |
Memory Density | 4.1943 Mbit | |
Memory Width | 1 | |
Organization | 4MX1 | |
Supply Voltage-Nom (Vsup) | 5 V | |
Power Supplies | ||
Access Time-Max | ||
Refresh Cycles | ||
Access Mode | FAST PAGE | |
Memory IC Type | FAST PAGE DRAM | |
Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
I/O Type | ||
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words Code | 4000000 | |
Number of Words | 4.1943 M | |
Operating Mode | ASYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Self Refresh | ||
Standby Current-Max | ||
Supply Current-Max | ||
Supply Voltage-Max (Vsup) | ||
Supply Voltage-Min (Vsup) | ||
Technology | CMOS | |
Temperature Grade | ||
JESD-30 Code | R-XUUC-N31 | |
Qualification Status | Not Qualified | |
JESD-609 Code | ||
Operating Temperature-Max | ||
Operating Temperature-Min | ||
Peak Reflow Temperature (Cel) | ||
Screening Level | ||
Time@Peak Reflow Temperature-Max (s) | ||
Number of Terminals | 31 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Equivalence Code | ||
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Surface Mount | YES | |
Terminal Finish | ||
Terminal Form | NO LEAD | |
Terminal Pitch | ||
Terminal Position | UPPER | |
Seated Height-Max | ||
Length | ||
Width | ||
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | DIE, | |
Reach Compliance Code | unknown | |
Part Package Code | WAFER | |
Pin Count | 31 | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 |
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