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MT49H32M9CHT-5
Micron Technology Inc
MT49H32M9CHT-5
TBGA,
Active
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MT49H32M9CHT-5 Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 301.9899 Mbit | |
| Memory Width | 9 | |
| Organization | 32MX9 | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Access Time-Max | 500 ps | |
| Clock Frequency-Max (fCLK) | ||
| Access Mode | MULTI BANK PAGE BURST | |
| Memory IC Type | DDR DRAM | |
| Additional Feature | AUTO REFRESH | |
| I/O Type | ||
| Interleaved Burst Length | ||
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Words Code | 32000000 | |
| Number of Words | 33.5544 M | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | ||
| Self Refresh | ||
| Sequential Burst Length | ||
| Standby Current-Max | ||
| Supply Current-Max | ||
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Technology | CMOS | |
| Temperature Grade | ||
| JESD-30 Code | R-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | ||
| Operating Temperature-Max | ||
| Operating Temperature-Min | ||
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | ||
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 1.2 mm | |
| Length | 18.5 mm | |
| Width | 11 mm | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | TBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 |
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