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MT48H8M16LFB4-10:J
Micron Technology Inc
MT48H8M16LFB4-10:J
VFBGA,
Active
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MT48H8M16LFB4-10:J Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Memory Density | 134.2177 Mbit | |
Memory Width | 16 | |
Organization | 8MX16 | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Access Time-Max | 7 ns | |
Clock Frequency-Max (fCLK) | ||
Refresh Cycles | ||
Access Mode | FOUR BANK PAGE BURST | |
Memory IC Type | SYNCHRONOUS DRAM | |
Additional Feature | AUTO/SELF REFRESH | |
I/O Type | ||
Interleaved Burst Length | ||
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words Code | 8000000 | |
Number of Words | 8.3886 M | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | ||
Self Refresh | YES | |
Sequential Burst Length | ||
Standby Current-Max | ||
Supply Current-Max | ||
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | S-PBGA-B54 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Peak Reflow Temperature (Cel) | ||
Time@Peak Reflow Temperature-Max (s) | ||
Number of Terminals | 54 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | ||
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 1 mm | |
Length | 8 mm | |
Width | 8 mm | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | VFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 | |
Part Package Code | BGA | |
Pin Count | 54 |
6,595
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