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MT47H512M4HG-5E:A
Micron Technology Inc
MT47H512M4HG-5E:A
TFBGA, BGA60,9X11,32
Active
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MT47H512M4HG-5E:A Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | ||
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Memory Density | 2.1475 Gbit | |
Memory Width | 4 | |
Organization | 512MX4 | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Access Time-Max | 600 ps | |
Clock Frequency-Max (fCLK) | 200 MHz | |
Refresh Cycles | 8192 | |
Access Mode | MULTI BANK PAGE BURST | |
Memory IC Type | DDR2 DRAM | |
Additional Feature | AUTO/SELF REFRESH | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words Code | 512000000 | |
Number of Words | 536.8709 M | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 12 mA | |
Supply Current-Max | 295 µA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Technology | CMOS | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B60 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Number of Terminals | 60 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA60,9X11,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 1.2 mm | |
Length | 14.5 mm | |
Width | 11.5 mm | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TFBGA, BGA60,9X11,32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Part Package Code | BGA | |
Pin Count | 60 |
15,926
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