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MT46V128M4FN-5BIT:C
Micron Technology Inc
MT46V128M4FN-5BIT:C
10 X 12.50 MM, FBGA-60
Active
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MT46V128M4FN-5BIT:C Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 536.8709 Mbit | |
Memory Width | 4 | |
Organization | 128MX4 | |
Supply Voltage-Nom (Vsup) | 2.6 V | |
Access Time-Max | 700 ps | |
Clock Frequency-Max (fCLK) | 200 MHz | |
Refresh Cycles | 8192 | |
Access Mode | FOUR BANK PAGE BURST | |
Memory IC Type | DDR1 DRAM | |
Additional Feature | AUTO/SELF REFRESH | |
I/O Type | COMMON | |
Interleaved Burst Length | 2,4,8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words Code | 128000000 | |
Number of Words | 134.2177 M | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Self Refresh | YES | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 5 mA | |
Supply Current-Max | ||
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.5 V | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B60 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | ||
Screening Level | ||
Time@Peak Reflow Temperature-Max (s) | ||
Number of Terminals | 60 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA60,9X12,40/32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 1.2 mm | |
Length | 12.5 mm | |
Width | 10 mm | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | 10 X 12.50 MM, FBGA-60 | |
Pin Count | 60 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 |
19,860
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