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MT16HTF12864AG-40EXX
Micron Technology Inc
MT16HTF12864AG-40EXX
DIMM,
Active
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MT16HTF12864AG-40EXX Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | ||
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 8.5899 Gbit | |
Memory Width | 64 | |
Organization | 128MX64 | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Power Supplies | ||
Access Time-Max | 600 ps | |
Clock Frequency-Max (fCLK) | ||
Refresh Cycles | ||
Access Mode | DUAL BANK PAGE BURST | |
Memory IC Type | DDR DRAM MODULE | |
Additional Feature | AUTO/SELF REFRESH | |
I/O Type | ||
Interleaved Burst Length | ||
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Words Code | 128000000 | |
Number of Words | 134.2177 M | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | ||
Self Refresh | YES | |
Sequential Burst Length | ||
Standby Current-Max | ||
Supply Current-Max | ||
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-XDMA-N240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | ||
Operating Temperature-Max | 55 °C | |
Operating Temperature-Min | ||
Peak Reflow Temperature (Cel) | ||
Time@Peak Reflow Temperature-Max (s) | ||
Number of Terminals | 240 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | ||
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | ||
Terminal Position | DUAL | |
Seated Height-Max | ||
Length | ||
Width | ||
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | DIMM | |
Package Description | DIMM, | |
Pin Count | 240 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 |
19,846
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