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EDS1232CABB-10L
Micron Technology Inc
EDS1232CABB-10L
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EDS1232CABB-10L Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Pbfree Code | ||
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 134.2177 Mbit | |
| Memory Width | 32 | |
| Organization | 4MX32 | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Power Supplies | ||
| Access Time-Max | 6 ns | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| Refresh Cycles | 4096 | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| Number of Words Code | 4000000 | |
| Number of Words | 4.1943 M | |
| Output Characteristics | 3-STATE | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 1 mA | |
| Supply Current-Max | 250 µA | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PBGA-B90 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | ||
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Peak Reflow Temperature (Cel) | ||
| Time@Peak Reflow Temperature-Max (s) | ||
| Number of Terminals | 90 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA90,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Package Description | ||
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 |
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