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EDS1232CABB-10-E
Micron Technology Inc
EDS1232CABB-10-E
FBGA, BGA90,9X15,32
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EDS1232CABB-10-E Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Pbfree Code | ||
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Memory Density | 134.2177 Mbit | |
Memory Width | 32 | |
Organization | 4MX32 | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Power Supplies | ||
Access Time-Max | 6 ns | |
Clock Frequency-Max (fCLK) | 100 MHz | |
Refresh Cycles | 4096 | |
Memory IC Type | SYNCHRONOUS DRAM | |
I/O Type | COMMON | |
Interleaved Burst Length | 1,2,4,8 | |
Number of Words Code | 4000000 | |
Number of Words | 4.1943 M | |
Output Characteristics | 3-STATE | |
Sequential Burst Length | 1,2,4,8,FP | |
Standby Current-Max | 1 mA | |
Supply Current-Max | 250 µA | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-PBGA-B90 | |
Qualification Status | Not Qualified | |
JESD-609 Code | ||
Moisture Sensitivity Level | ||
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Peak Reflow Temperature (Cel) | ||
Time@Peak Reflow Temperature-Max (s) | ||
Number of Terminals | 90 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA90,9X15,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | ||
Terminal Form | BALL | |
Terminal Pitch | 800 µm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | FBGA, BGA90,9X15,32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 |
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