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88AP303-A1-BGF2C624-TN32
Marvell Technology Group Ltd
88AP303-A1-BGF2C624-TN32
LFBGA, BGA409,23X23,32
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88AP303-A1-BGF2C624-TN32 Attributes
| TYPE | DESCRIPTION | SELECT |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Bit Size | ||
| Speed | ||
| External Data Bus Width | ||
| Address Bus Width | ||
| Clock Frequency-Max | ||
| Surface Mount | YES | |
| Supply Voltage-Nom | ||
| uPs/uCs/Peripheral ICs Type | SoC | |
| Technology | CMOS | |
| Boundary Scan | ||
| Format | ||
| Integrated Cache | ||
| Low Power Mode | ||
| Supply Voltage-Max | 3.3 V | |
| Supply Voltage-Min | 1.8 V | |
| Temperature Grade | OTHER | |
| JESD-30 Code | ||
| Qualification Status | Not Qualified | |
| JESD-609 Code | ||
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Peak Reflow Temperature (Cel) | ||
| Time@Peak Reflow Temperature-Max (s) | ||
| Number of Terminals | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | ||
| Package Equivalence Code | ||
| Package Shape | SQUARE | |
| Package Style | ||
| Terminal Finish | ||
| Terminal Form | BALL | |
| Terminal Pitch | ||
| Terminal Position | BOTTOM | |
| Seated Height-Max | ||
| Width | ||
| Length | ||
| Ihs Manufacturer | MARVELL SEMICONDUCTOR INC | |
| Package Description | LFBGA, BGA409,23X23,32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 409 |
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