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ACA-SPI-006-K01

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ACA-SPI-006-K01
SPI 16 PIN_IC 300mil
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ACA-SPI-006-K01
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ACA-SPI-006-K01 Attributes
TYPE DESCRIPTION SELECT
Series -
Type SOIC
Number of Positions or Pins (Grid) 16 (2 x 8)
Pitch - Mating 0.050" (1.27mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 1.00µin (0.025µm)
Contact Material - Mating Phosphor Bronze
Mounting Type Surface Mount
Features Board Guide, Closed Frame
Termination Solder
Pitch - Post 0.050" (1.27mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 1.00µin (0.025µm)
Contact Material - Post Phosphor Bronze
Housing Material Liquid Crystal Polymer (LCP)
Operating Temperature -
4,532 In Stock
rhos iso9001 iso13485 iso14001 iso45001
Minimum: 1
Unit Price: $20.00
Total Price: $20.00
This price is for reference only, please contact us for now price support@easev.net.

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