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40-526-10

Aries Electronics
40-526-10
CONN IC DIP SOCKET ZIF 40POS TIN
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40-526-10
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40-526-10 Attributes
TYPE DESCRIPTION SELECT
Series Lo-PRO®file, 526
Type DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Material - Post Beryllium Copper
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature -55°C ~ 105°C
8,662 In Stock
rhos iso9001 iso13485 iso14001 iso45001
Minimum: 1
Unit Price: $15.18
Total Price: $15.18
This price is for reference only, please contact us for now price support@easev.net.

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