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28-6554-10

Aries Electronics
28-6554-10
CONN IC DIP SOCKET ZIF 28POS TIN
Active
28-6554-10
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28-6554-10 Attributes
TYPE DESCRIPTION SELECT
Series 55
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 28 (2 x 14)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 200.0µin (5.08µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -
1,946 In Stock
rhos iso9001 iso13485 iso14001 iso45001
Minimum: 1
Unit Price: $15.22
Total Price: $15.22
This price is for reference only, please contact us for now price support@easev.net.

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