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20-822-90C

Aries Electronics
20-822-90C
CONN IC DIP SOCKET 20POS GOLD
Active
20-822-90C
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20-822-90C Attributes
TYPE DESCRIPTION SELECT
Series Vertisockets™ 800
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 20 (2 x 10)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole, Right Angle, Horizontal
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Brass
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature -55°C ~ 105°C
444 In Stock
rhos iso9001 iso13485 iso14001 iso45001
Minimum: 1
Unit Price: $10.33
Total Price: $10.33
This price is for reference only, please contact us for now price support@easev.net.

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