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DILB32P-223TLF
Amphenol ICC (FCI)
DILB32P-223TLF
CONN IC DIP SOCKET 32POS TINLEAD
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DILB32P-223TLF Attributes
TYPE | DESCRIPTION | SELECT |
---|---|---|
Series | DILB | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Number of Positions or Pins (Grid) | 32 (2 x 16) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Tin-Lead | |
Contact Finish Thickness - Mating | 100.0µin (2.54µm) | |
Contact Material - Mating | Copper Alloy | |
Mounting Type | Through Hole | |
Features | Open Frame | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Tin-Lead | |
Contact Finish Thickness - Post | 100.0µin (2.54µm) | |
Contact Material - Post | Copper Alloy | |
Housing Material | Polyamide (PA), Nylon | |
Operating Temperature | -55°C ~ 125°C |
5,916
In Stock
Minimum: 1
Unit Price:
$1.09
Total Price:
$1.09
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