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DILB24P-223TLF

Amphenol ICC (FCI)
DILB24P-223TLF
CONN IC DIP SOCKET 24POS TINLEAD
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DILB24P-223TLF
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DILB24P-223TLF Attributes
TYPE DESCRIPTION SELECT
Series DILB
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin-Lead
Contact Finish Thickness - Mating 100.0µin (2.54µm)
Contact Material - Mating Copper Alloy
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin-Lead
Contact Finish Thickness - Post 100.0µin (2.54µm)
Contact Material - Post Copper Alloy
Housing Material Polyamide (PA), Nylon
Operating Temperature -55°C ~ 125°C
8,623 In Stock
rhos iso9001 iso13485 iso14001 iso45001
Minimum: 1
Unit Price: $0.45
Total Price: $0.45
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