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130-024-000

3M
130-024-000
CONN IC DIP SOCKET 24POS GOLD
Active
130-024-000
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130-024-000 Attributes
TYPE DESCRIPTION SELECT
Series 100
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 8.00µin (0.203µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post Flash
Contact Material - Post Brass
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -65°C ~ 125°C
6,577 In Stock
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Minimum: 1
Unit Price: N/A
Total Price: N/A
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